Effect of pre-strain on microstructure and micro-yield properties of Al-Cu-Li alloy.

Wang, Defa; Yang, Ruibin; Huang, Junjie; Liu, Zhongxia; Zhang, Guopeng; Cai, Bin

Wang, Defa; Yang, Ruibin; Huang, Junjie; Liu, Zhongxia; Zhang, Guopeng; Cai, Bin.

Afiliación

Wang D; Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan Province, 450052, China.
Yang R; School of Basic Sciences, Zhengzhou University of Technology, Zhengzhou, Henan Province, 450044, China. Electronic address: Yang_Ruibin@163.com.
Huang J; Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan Province, 450052, China.
Liu Z; Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan Province, 450052, China. Electronic address: liuzhongxia@zzu.edu.cn.
Zhang G; Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan Province, 450052, China.
Cai B; Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan Province, 450052, China.

Micron ; 148: 103092, 2021 Sep.

Article en En | MEDLINE | ID: mdl-34116460

Palabras clave

Al-Cu-Li alloy; Dislocation density; Micro-yield strength; Pre-strain; T1 precipitates

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micron Asunto de la revista: DIAGNOSTICO POR IMAGEM Año: 2021 Tipo del documento: Article País de afiliación: China Pais de publicación: Reino Unido

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