Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures.

Wang, Ziyang; Sun, Fangyuan; Liu, Zihan; Zheng, Libing; Wang, Dazheng; Feng, Yanhui

Wang, Ziyang; Sun, Fangyuan; Liu, Zihan; Zheng, Libing; Wang, Dazheng; Feng, Yanhui.

Afiliación

Wang Z; School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Sun F; School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Liu Z; School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Zheng L; Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China.
Wang D; University of Chinese Academy of Science, Beijing 100049, China.
Feng Y; Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China.

ACS Appl Mater Interfaces ; 15(12): 16162-16176, 2023 Mar 29.

Article en En | MEDLINE | ID: mdl-36924078

Palabras clave

interfacial roughness; molecular dynamics simulation; phonon transmission efficiency; thermal boundary conductance; time-domain thermoreflectance

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2023 Tipo del documento: Article País de afiliación: China Pais de publicación: Estados Unidos

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