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Crack-Based Sensor with Microstructures for Strain and Pressure Sensing.
Kim, Nakung; Yun, Daegeun; Hwang, Injoo; Yoon, Gibaek; Kang, Seong Min; Choi, Yong Whan.
Afiliação
  • Kim N; Division of Mechanical Convergence Engineering, College of MICT Convergence Engineering, Silla University, Busan 46958, Republic of Korea.
  • Yun D; Division of Mechanical Convergence Engineering, College of MICT Convergence Engineering, Silla University, Busan 46958, Republic of Korea.
  • Hwang I; Division of Mechanical Convergence Engineering, College of MICT Convergence Engineering, Silla University, Busan 46958, Republic of Korea.
  • Yoon G; Division of Mechanical Convergence Engineering, College of MICT Convergence Engineering, Silla University, Busan 46958, Republic of Korea.
  • Kang SM; Department of Mechanical Engineering, Chungnam National University, Daejeon 34134, Republic of Korea.
  • Choi YW; Division of Mechanical Convergence Engineering, College of MICT Convergence Engineering, Silla University, Busan 46958, Republic of Korea.
Sensors (Basel) ; 23(12)2023 Jun 13.
Article em En | MEDLINE | ID: mdl-37420710
Recent extensive research on flexible electronics has led to the development of various flexible sensors. In particular, sensors inspired by the slit organs of a spider, which utilize cracks in a metal film to measure strain, have garnered considerable interest. This method exhibited significantly high sensitivity, repeatability, and durability in measuring strain. In this study, a thin-film crack sensor was developed using a microstructure. The results exhibited its ability to simultaneously measure the tensile force and pressure in a thin film, further expanding its applications. Furthermore, the strain and pressure characteristics of the sensor were measured and analyzed using an FEM simulation. The proposed method is expected to contribute to the future development of wearable sensors and artificial electronic skin research.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Revista: Sensors (Basel) Ano de publicação: 2023 Tipo de documento: Article País de publicação: Suíça

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Revista: Sensors (Basel) Ano de publicação: 2023 Tipo de documento: Article País de publicação: Suíça